TEC Visits SIRIM Showcase to Explore Digital Twin Innovations

Bukit Jalil, Malaysia – Telecommunication Engineering College (TEC) recently participated in the Solutions Showcase Day at SIRIM Bukit Jalil, an event spotlighting the latest advancements in Digital Twin applications for Smart Manufacturing, Semiconductors, & Electronics. The session featured real-world demonstrations of how digital technologies are revolutionizing quality inspection and automation across various industries. From precision-driven manufacturing lines to AI-enhanced electronics testing, the showcase provided invaluable insights into how innovation is reshaping industrial processes.

For TEC, this visit was more than just an observation—it was a strategic move to gather ideas and inspiration for its own education-based Proof of Concept (PoC) projects. By aligning its curriculum with industry needs, TEC aims to equip students with future-ready skills and hands-on experience in emerging technologies.

“Staying ahead in technical education means immersing ourselves in real innovations,” said a TEC representative. “Engagements like these help us bridge the gap between classroom theory and industry practice.”

As part of its ongoing commitment to developing industry-relevant education, TEC continues to engage with thought leaders and technology partners to ensure students are prepared for the digital-first workforce.